Wafer Vacuum Transfer Module (VTM)
The Vacuum Transfer Module (VTM) is used in vacuum processes such as wafer etching, deb (CVD, PVD, ALD), etc. Due to the bent requirements of the process environment, the transfer equipment VTM needs to meet ultra-high vacuum, ultra-low vibration, corrosion resistance, high-temperature resistance, and other requirements.
Item |
HH400 |
HH500 |
HH600 |
HH700 |
HH800 |
Frame |
Welded tubular construction with support,The surface is coated with white paint |
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Wafer Transport Plane |
1100mm(Per SEMI std.E 21-91) |
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Process Facets |
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Up to 3 |
Up to 3 |
Up to 4 |
Up to 5 |
Up to 6 |
|
Vacuum Robot |
HHVRD3/4 |
HHVRD3/4 |
HHVRD3/4 |
HHVRD3/4 |
HHVRD3/4 |
Arm Blade |
Customized according to customer specifications,;Optional:1 Blade,2 Blade and 4 Blade;Material optional |
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Load Locks |
Provides Load Locks(1 or 2) and Slot(1 or 2 or 4 etc) Number customization |
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Lid |
View Ports Optional |
Lid Lift Mechanism |
Lid Lift Mechanism |
Lid Lift Mechanism |
Lid Lift Mechanism |
Option:Cooling Station,VPA Station or Separating Station |
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Optional Chamber |
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AWC |
< 0.05mm |
< 0.05mm |
< 0.05mm |
< 0.05mm |
< 0.05mm |
Base Vacuum |
5 x 10−8 Torr |
5 x 10−8 Torr |
5 x 10−8 Torr |
5 x 10−8 Torr |
5 x 10−8 Torr |
Leak Rate |
<1 x10−9std.cc/sec He |
<1 x10−9std.cc/sec He |
<1 x10−9std.cc/sec He |
<1 x10−10std.cc/sec He
|
<1 x10−9std.cc/sec He |
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